Byung Hak Kim

Title: Byung Hak Kim: Innovator in Surface Acoustic Wave Technology

Introduction

Byung Hak Kim is a notable inventor based in Gyeonggi-do, South Korea. He has made significant contributions to the field of surface acoustic wave technology, particularly through his innovative patent.

Latest Patents

Byung Hak Kim holds a patent for "Surface acoustic wave wafer level packages with organic solderability preservative coating layers and manufacturing methods thereof." This invention involves a surface acoustic wave wafer level package that includes a substrate, an interdigital transducer (IDT) formed on the substrate, a sidewall formed on the substrate along the periphery of the IDT, and a cover formed above the sidewall and the IDT to create a hollow above the IDT. The package also features a connection electrode extending outward from the periphery of the sidewall, a connection terminal electrically connected to part of the connection electrode, and an organic solderability preservative coating layer on at least the top surface of the connection terminal. Byung Hak Kim has 1 patent to his name.

Career Highlights

Byung Hak Kim is currently employed at Wisol Co., Ltd., where he continues to develop and innovate in the field of surface acoustic wave technology. His work has contributed to advancements in the manufacturing methods of these specialized packages.

Collaborations

Throughout his career, Byung Hak Kim has collaborated with talented individuals such as Suk Hwan Jang and Chang Yup Lee. These collaborations have further enhanced his work and contributions to the field.

Conclusion

Byung Hak Kim is a distinguished inventor whose work in surface acoustic wave technology has led to significant advancements in the industry. His innovative patent and collaborations reflect his commitment to pushing the boundaries of technology.