Jin-Cheng Lin

Title: Jin-Cheng Lin: Innovator in Chip-on-Wafer Technology

Introduction

Jin-Cheng Lin is a prominent inventor based in Chu Tung Zhen, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly in the development of innovative packaging solutions. His work has led to advancements that enhance the performance and reliability of electronic devices.

Latest Patents

Jin-Cheng Lin holds 1 patent for his invention titled "Chip-on-wafer structures and methods for forming the same." This patent describes a package component that includes a substrate with a front and back surface. A through-via penetrates the substrate, allowing for electrical connections. The design features a conductive element on the back surface, which is coupled to the through-via. Additionally, the invention incorporates dielectric patterns and Under-Bump-Metallurgy (UBM) to improve the overall functionality of the component.

Career Highlights

Jin-Cheng Lin is associated with Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His role at the company has allowed him to work on cutting-edge technologies that are crucial for modern electronics. His expertise in chip packaging has positioned him as a valuable asset in the field.

Collaborations

Throughout his career, Jin-Cheng Lin has collaborated with notable colleagues, including Shih Ting Lin and Hsin Chang. These partnerships have fostered an environment of innovation and have contributed to the successful development of advanced semiconductor technologies.

Conclusion

Jin-Cheng Lin's contributions to chip-on-wafer technology exemplify his commitment to innovation in the semiconductor industry. His patent and work at Taiwan Semiconductor Manufacturing Company Limited highlight his role as a key inventor in this rapidly evolving field.