This inventor holds 1 USPTO granted patent and 8 published patent applications. Top assignee: Intel Corporation. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Innovations by Jiaqi Wu in Liquid Metal Technology
Introduction
Jiaqi Wu is an accomplished inventor based in Chandler, AZ (US). He has made significant contributions to the field of integrated circuit technology. His innovative work focuses on enhancing the reliability of electronic components through advanced materials.
Latest Patents
Jiaqi Wu holds a patent for "Bumps comprising tin, copper, and bismuth for liquid metal socket interconnects." This patent describes an integrated circuit apparatus that includes a substrate with electrical contacts, a passivation layer, metal pads, and solder bumps. The solder bumps are designed to resist Gallium-based liquid metal embrittlement, which is crucial for maintaining the integrity of electronic devices.
Career Highlights
Jiaqi Wu is currently employed at Intel Corporation, where he continues to push the boundaries of technology. His work is instrumental in developing more reliable and efficient electronic components. With a focus on innovative materials, he aims to improve the performance of integrated circuits.
Collaborations
Jiaqi has collaborated with talented coworkers, including Xiao Lu and Bohan Shan. These partnerships have fostered a creative environment that encourages the development of groundbreaking technologies.
Conclusion
Jiaqi Wu's contributions to liquid metal technology and integrated circuits exemplify the spirit of innovation. His patent and work at Intel Corporation highlight the importance of advanced materials in modern electronics.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile