Company Filing History:
Years Active: 2023
Title: Innovations of Jianxun Chen
Introduction
Jianxun Chen is a notable inventor based in Shanghai, China. He has made significant contributions to the field of semiconductor technology, holding a total of 3 patents. His work focuses on advanced methods for manufacturing semiconductor devices and improving copper plating processes.
Latest Patents
One of Jianxun Chen's latest patents is a "Method of Copper Plating Filling." This patent discloses a copper plating filling process that involves forming a trench or a through-hole in a dielectric layer. The process includes forming a copper seed layer on the inner surface of the hole, allowing a waiting time for oxidation, performing a reduction process on the copper oxide layer, and subsequently filling a copper layer into the hole. The uniform thickness of the copper seed layer is a key feature of this innovation.
Another significant patent is the "Method for Manufacturing Semiconductor Device." This method outlines the steps for providing a substrate with an amorphous silicon layer, forming an etching auxiliary layer, and etching both layers to achieve a target thickness. The result is a flat upper surface of the etched amorphous silicon layer, which is crucial for semiconductor applications.
Career Highlights
Jianxun Chen is currently employed at Shanghai Huali Integrated Circuit Corporation, where he continues to develop innovative solutions in semiconductor technology. His expertise and contributions have positioned him as a valuable asset in the industry.
Collaborations
Jianxun Chen has collaborated with notable coworkers, including Changhung Kung and Xiumei Hu. Their combined efforts have further advanced the research and development of semiconductor technologies.
Conclusion
Jianxun Chen's innovative work in semiconductor manufacturing and copper plating processes highlights his significant role in the field. His patents reflect a commitment to advancing technology and improving manufacturing methods.