Spokane, WA, United States of America

Jianxing Li

USPTO Granted Patents = 19 


Average Co-Inventor Count = 2.7

ph-index = 6

Forward Citations = 84(Granted Patents)


Location History:

  • Spokane, WA (US) (2001 - 2006)
  • Tualatin, OR (US) (2018)
  • Spokane Valley, WA (US) (2016 - 2020)

Company Filing History:


Years Active: 2001-2020

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19 patents (USPTO):Explore Patents

Title: Innovator Spotlight: Jianxing Li and His Contributions to Lead-Free Solder Technology

Introduction: Jianxing Li, a prolific inventor based in Spokane, WA, has made significant strides in the field of material science, particularly in the development of lead-free solder compositions. With a total of 19 patents to his name, Li exemplifies the innovative spirit necessary for driving advancements in technology.

Latest Patents: Among his notable inventions are his recent patents on lead-free solder compositions. These compositions include 85 to 95 weight percent bismuth and at least 5 weight percent copper, designed for high-performance soldering applications. The solder wire boasts a diameter of less than about 1 millimeter, and possesses an impressive elongation at break of at least 20%. His work addresses the growing demand for environmentally friendly solder materials free of lead, aligning with global sustainability goals.

Career Highlights: Jianxing Li is currently employed at Honeywell International Inc., where he has played a pivotal role in advancing the company’s materials technology portfolio. His expertise has made him an invaluable asset to the team, contributing to Honeywell's reputation for innovation in various sectors, including aerospace and industrial solutions.

Collaborations: Throughout his career, Jianxing Li has collaborated with talented colleagues such as Tim Scott and Tamara White. These partnerships have fostered a dynamic innovation environment, enabling the development of cutting-edge technologies that push the boundaries of current capabilities.

Conclusion: Jianxing Li’s work demonstrates the impact of innovative thinking in material science, exemplified by his development of lead-free solder compositions. As he continues to contribute to the field through his patents and collaborations at Honeywell International Inc., he remains a figure to watch in the advancements of sustainable technology.

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