The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 14, 2018
Filed:
Feb. 20, 2014
Applicant:
Honeywell International Inc., Morris Plains, NJ (US);
Inventors:
Jianxing Li, Tualatin, OR (US);
Michael R. Pinter, Spokane, WA (US);
Vikki L. Johnson, Spokane, WA (US);
Assignee:
Honeywell International Inc., Morris Plains, NJ (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 35/36 (2006.01); B23K 35/02 (2006.01); C22C 12/00 (2006.01); C22F 1/16 (2006.01); B23K 35/26 (2006.01); B21C 23/08 (2006.01);
U.S. Cl.
CPC ...
B23K 35/0227 (2013.01); B21C 23/08 (2013.01); B23K 35/264 (2013.01); C22C 12/00 (2013.01); C22F 1/16 (2013.01);
Abstract
A solder wire composition may include 85 to 95 weight percent bismuth, and at least 5 weight percent copper. The solder wire composition may have a diameter of less than about 1 millimeter, and an elongation at break of at least 20%.