Hsinchu, Taiwan

Jiann-Mo Lee

This inventor holds 1 USPTO granted patent. Top assignee: United Microelectronics Corp.. Active years: 2015.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Jiann-Mo Lee. Retrieved from https://idiyas.com/inventor/jiann-mo-lee

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 5.0

ph-index = 1

Forward Citations = 3(Granted Patents)


Company Filing History:


Years Active: 2015

Loading Chart...
1 patent (USPTO):Explore Patents

Title: Jiann-Mo Lee: Innovator in Chemical-Mechanical Polishing Technology

Introduction

Jiann-Mo Lee is a prominent inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of chemical-mechanical polishing (CMP) technology. His innovative work has led to the development of a unique dispenser that enhances the efficiency of CMP processes.

Latest Patents

Jiann-Mo Lee holds 1 patent for his invention titled "Dispenser for chemical-mechanical polishing (CMP) apparatus, CMP apparatus having the dispenser, and CMP process using the CMP apparatus." This patent describes a dispenser that includes a delivery arm positioned over a polishing pad of a CMP apparatus. The design features at least one slurry delivery groove that extends along the length of the delivery arm, along with multiple first openings connected to the slurry delivery groove.

Career Highlights

Jiann-Mo Lee is associated with United Microelectronics Corporation, a leading semiconductor foundry. His work at this company has allowed him to focus on advancing CMP technologies, which are crucial for the manufacturing of integrated circuits.

Collaborations

Throughout his career, Jiann-Mo Lee has collaborated with notable colleagues, including Liang-Chuo Ham and Chin-Chuan Chih. These partnerships have fostered innovation and contributed to the development of cutting-edge CMP solutions.

Conclusion

Jiann-Mo Lee's contributions to chemical-mechanical polishing technology exemplify his commitment to innovation in the semiconductor industry. His patent and collaborative efforts continue to influence advancements in this critical field.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…