The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 08, 2015
Filed:
Jun. 21, 2011
Applicants:
Liang-chuo Ham, Hsinchu, TW;
Chin-chuan Chih, Miaoli County, TW;
Jiann-mo Lee, Hsinchu, TW;
Chia-ming Yang, New Taipei, TW;
Wen-yen Chen, Miaoli County, TW;
Inventors:
Liang-Chuo Ham, Hsinchu, TW;
Chin-Chuan Chih, Miaoli County, TW;
Jiann-Mo Lee, Hsinchu, TW;
Chia-Ming Yang, New Taipei, TW;
Wen-Yen Chen, Miaoli County, TW;
Assignee:
UNITED MICROELECTRONICS CORP., Science-Based Industrial Park, Hsin-Chu, TW;
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/306 (2006.01); B24B 57/00 (2006.01); B24B 57/02 (2006.01); H01L 21/321 (2006.01); H01L 21/67 (2006.01); B24B 3/02 (2006.01);
U.S. Cl.
CPC ...
B24B 57/02 (2013.01); B24B 3/02 (2013.01); H01L 21/3212 (2013.01); H01L 21/32115 (2013.01); H01L 21/6708 (2013.01); H01L 21/67051 (2013.01);
Abstract
A dispenser for a chemical-mechanical polishing (CMP) apparatus, includes a delivery arm disposed over a polishing pad of a CMP apparatus, at least a slurry delivery groove formed in the delivery arm and extending along a length of the delivery arm, and a plurality of first openings connected to the slurry delivery groove.