Guangdong, China

Jiang-Jian Wen

This inventor holds 3 USPTO granted patents. Top assignees: Foxconn Technology Co., Ltd., Fu Zhun Precision Industry (Shen Zhen) Co., Ltd.. Active years: 2007-2009.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Jiang-Jian Wen. Retrieved from https://idiyas.com/inventor/jiang-jian-wen

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

Average Co-Inventor Count = 3.8

ph-index = 2

Forward Citations = 32(Granted Patents)


Location History:

  • Shenzhen, CN (2008)
  • Guangdong, CN (2007 - 2009)

Company Filing History:


Years Active: 2007-2009

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3 patents (USPTO):Explore Patents

Title: Jiang-Jian Wen: A Pioneer in Heat Dissipation Technologies

Introduction

Jiang-Jian Wen, based in Guangdong, China, is a notable inventor with a significant impact in the field of heat dissipation technology. He holds three patents, showcasing his innovative contributions to improving thermal management systems. His work is particularly relevant in electronics, where effective heat dissipation is crucial for the performance and longevity of devices.

Latest Patents

Wen's most recent patents are centered around advanced heat dissipation devices. One of his patents details a "Heat Dissipation Device with Heat Pipes," which consists of a fin set, two base plates, and two heat pipes. This device is designed to effectively transfer heat from heat-generating electronic devices by sandwiching the heat pipes and fin set between the base plates.

Another noteworthy patent from Wen is for a "Liquid Cooling Device," which features a heat-dissipating unit and a heat-absorbing unit connected by inlet and outlet pipes, creating a closed circulation loop. This system utilizes a pump to circulate liquid coolant, transferring heat away from vital components, thus enhancing efficiency in thermal management.

Career Highlights

Throughout his career, Jiang-Jian Wen has been associated with reputable companies such as Fu Zhun Precision Industry (Shenzhen) Co., Ltd. and Foxconn Technology Co., Ltd. His work in these organizations has likely contributed to his expertise in developing innovative thermal management solutions that benefit a variety of electronic applications.

Collaborations

In the course of his career, Wen has collaborated with other talented professionals, including Cheng-Tien Lai and Zhi-Yong Zhou. These collaborations have fostered a creative environment conducive to innovation, leading to the development of patents that address critical challenges in heat dissipation.

Conclusion

Jiang-Jian Wen’s inventive spirit and commitment to advancing heat dissipation technology have positioned him as a notable figure in his field. With three patents highlighting his innovations, his work continues to influence the design and efficiency of electronic devices. As technology progresses, the relevance of his contributions remains significant, ensuring that devices operate reliably under thermal constraints.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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