The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 06, 2009

Filed:

Dec. 25, 2005
Applicants:

Hsieh-kun Lee, Guangdong, CN;

Cheng-tien Lai, Guangdong, CN;

Zhi-bin Tan, Guangdong, CN;

Zhi-yong Zhou, Guangdong, CN;

Jiang-jian Wen, Guangdong, CN;

Inventors:

Hsieh-Kun Lee, Guangdong, CN;

Cheng-Tien Lai, Guangdong, CN;

Zhi-Bin Tan, Guangdong, CN;

Zhi-Yong Zhou, Guangdong, CN;

Jiang-Jian Wen, Guangdong, CN;

Assignees:

Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Shenzhen, Guangdong Province, CN;

Foxconn Technology Co., Ltd., Tu-Cheng, Taipei Hsien, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F28F 7/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A heat dissipation device includes a fin set, first and second base plates and first and second heat pipes. The first base plate has a face for contacting a heat generating electronic device. The first heat pipe includes first and second sections sandwiching the fin set between the first and second sections and engaging with the fin set. The first and second base plates sandwich the first heat pipe and the fin set between the first and second base plates and engage with the first heat pipe and the fin set. The second heat pipe includes first and second sections sandwiching the first heat pipe, the fin set, the first and second base plates between the first and second sections of the second heat pipe and engaging with the first and second base plates.


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