This inventor holds 1 USPTO granted patent. Top assignee: Intel Corporation. Active years: 2024.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2024
Title: The Innovative Contributions of Jianfeng Hu
Introduction
Jianfeng Hu is a prominent inventor based in Shanghai, China. He is known for his significant contributions to the field of semiconductor packaging. With a focus on innovative solutions, Hu has developed technologies that enhance the performance and reliability of semiconductor devices.
Latest Patents
One of Jianfeng Hu's notable patents is titled "Film in substrate for releasing z stack-up constraint." This invention includes semiconductor packages and a method of forming these packages. The semiconductor package features a package substrate with multiple cavities and adhesives within those cavities. Additionally, it comprises stacked dies positioned over the adhesives and the package substrate, with spacers strategically placed below the outer edges of the stacked dies. The adhesives utilized in this invention include various films, and the package may also contain interconnects, electrical components, and a mold layer covering the stacked dies and other components.
Career Highlights
Jianfeng Hu is currently employed at Intel Corporation, a leading technology company known for its advancements in semiconductor technology. His work at Intel has allowed him to contribute to cutting-edge innovations in the industry. With a total of 1 patent, Hu's inventive efforts have made a notable impact on semiconductor packaging.
Collaborations
Throughout his career, Jianfeng Hu has collaborated with talented colleagues, including Zhicheng Ding and Yong She. These collaborations have fostered an environment of innovation and creativity, leading to the development of advanced technologies in semiconductor packaging.
Conclusion
Jianfeng Hu's contributions to the field of semiconductor packaging exemplify the importance of innovation in technology. His patent and work at Intel Corporation highlight his commitment to advancing the industry. Through collaboration and creativity, Hu continues to make significant strides in the world of semiconductor technology.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile