This inventor holds 1 USPTO granted patent and 11 published patent applications. Top assignee: Tong Hsing Electronic Industries, Ltd.. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Jian-yu Shih and Power Component Submount Innovation.
Introduction
Jian-yu Shih is an inventor based in Taoyuan, Taiwan, associated with Tong Hsing Electronic Industries, Ltd. His patent work includes a design for a power component submount and a method for manufacturing it.
Latest Patents
Shih is credited with 1 patent: “Power Component Submount and Manufacturing Method Thereof.” The invention describes a ceramic substrate with a sputtering layer and a conductive block formed on an electroplating portion of that layer. Three electroless plating layers are stacked on the conductive block, using either gold, palladium, and gold, or nickel, palladium, and gold. The outermost layer is designed to provide a mounting surface for a power component.
Career Highlights
Shih’s patent reflects work on the structure and manufacture of submounts for power components. The design combines a ceramic substrate with conductive and plated layers.
Collaborations
The patent record identifies Jia-Zheng Xu and Jhih-wei Lai as Shih’s coworkers. His company affiliation is Tong Hsing Electronic Industries, Ltd.
Conclusion
Jian-yu Shih’s patent documents an approach to constructing a plated ceramic submount intended to support the mounting of a power component.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile