This inventor holds 6 USPTO granted patents and 1 published patent application. Top assignees: Foxconn Technology Co., Ltd., Fu Zhun Precision Industry (Shen Zhen) Co., Ltd.. Active years: 2010-2012.
Company Filing History:
6 out of 1,231 
6 out of 778 Years Active: 2010-2012
Title: Innovations by Jian-Ping Yu
Introduction
Jian-Ping Yu is a notable inventor based in Shenzhen, China. He has made significant contributions to the field of electronic device assembly, holding a total of 6 patents. His work focuses on enhancing the efficiency and effectiveness of heat dissipation in electronic devices.
Latest Patents
One of his latest patents is a heat dissipation device for electronic device assembly. This device is designed to cool an electronic device mounted on a printed circuit board. It features a base plate that is thermally attached to the electronic device, along with a clip that secures the device to the printed circuit board. The base plate includes two protruding poles that extend through the printed circuit board, establishing a secure location for the heat dissipation device. The clip ensures that the device remains fastened once its position is set.
Another significant patent is a fastening assembly for a heat dissipation device. This assembly is used to secure the device to a printed circuit board and consists of a sleeve, an inserting device, a spring, and a supporting device. The inserting device engages with a back plate located below the printed circuit board. The sleeve is made of plastic and features a hollow body with a resilient portion that presses the heat dissipation device upward. The supporting device is inserted between the body and the resilient portion, ensuring that the resilient portion remains locked in place.
Career Highlights
Jian-Ping Yu has worked with prominent companies in the technology sector, including Fu Zhun Precision Industry (Shenzhen) Co., Ltd. and Foxconn Technology Co., Ltd. His experience in these organizations has contributed to his expertise in developing innovative solutions for electronic devices.
Collaborations
Throughout his career, Jian-Ping Yu has collaborated with talented individuals such as Wei Wu and Cui-Jun Lu. These partnerships have fostered a creative environment that has led to the development of his patented technologies.
Conclusion
Jian-Ping Yu's contributions to the field of electronic device assembly through his innovative patents demonstrate his commitment to advancing technology. His work continues to influence the industry and improve the performance of electronic devices.