The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7746651 B1

PDF
Full Text
Expired
Date of Patent:
Jun. 29, 2010

Filed:

Jul. 31, 2007
Applicants:

Jian-ping Yu, Shenzhen, CN;

Dong-yun LI, Shenzhen, CN;

Wei Wu, Shenzhen, CN;

Inventors:

Jian-Ping Yu, Shenzhen, CN;

Dong-Yun Li, Shenzhen, CN;

Wei Wu, Shenzhen, CN;

Assignees:

Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Shenzhen, Guangdong Province, CN;

Foxconn Technology Co., Ltd., Tu-Cheng, Taipei Hsien, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H01L 23/34 (2006.01); F28F 7/00 (2006.01); A47B 97/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A heat sink assembly includes a heat sink and a clip for mounting the heat sink to an electronic component of a printed circuit board. The heat sink includes a base and a plurality of fins extending from the base. The clip includes a pressing member and a pair of elongated arms formed on opposite ends of the pressing member. The pressing member has a lower portion protruding toward the base of the heat sink. A middle one of the fins extends upwardly through the pressing member in a manner such that the lower portion of the pressing member resiliently abuts against the heat sink. The two arms are located on opposite lateral sides of the heat sink and bent downwardly to engage with the printed circuit board so that the pressing member exerts a force on the heat sink toward the electronic component.


Find Patent Forward Citations

Quick Actions:

Yu, Jian-Ping. (2010). Heat sink assembly having a clip (U.S. Patent No. 7746651). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7746651

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…