Jian-Hong Su

Title: Innovations by Jian-Hong Su in Semiconductor Technology

Introduction

Jian-Hong Su is a prominent inventor based in Singapore, known for his contributions to semiconductor technology. With a total of 2 patents, he has made significant advancements in methods for filling trenches with metal layers in semiconductor structures.

Latest Patents

His latest patents include a method for filling a trench with a metal layer and a semiconductor structure formed by using the same. This innovative method involves a deposition apparatus with multiple supporting pins, where a substrate and a dielectric layer are utilized. The process begins with a first deposition phase that gradually increases the substrate's temperature to a predetermined level. Once this temperature is achieved, a second deposition process is executed to completely fill the trench with the metal layer. This invention also leads to the creation of a semiconductor device featuring an aluminum layer with a reflectivity greater than 1.

Career Highlights

Jian-Hong Su is currently associated with United Microelectronics Corporation, where he continues to push the boundaries of semiconductor technology. His work has been instrumental in enhancing the efficiency and performance of semiconductor devices.

Collaborations

He has collaborated with notable colleagues such as Chi-Mao Hsu and Hsin-Fu Huang, contributing to a dynamic research environment that fosters innovation.

Conclusion

Jian-Hong Su's contributions to semiconductor technology through his patents and collaborations highlight his role as a key innovator in the field. His work continues to influence advancements in semiconductor manufacturing processes.