This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Jian Cheng Chen and His Work in Wafer-Chuck Thermal Testing.
Introduction
Jian Cheng Chen is an inventor associated with Hsinchu, Taiwan. His patent work addresses thermal testing for wafer chucks, equipment used in semiconductor manufacturing.
Latest Patents
Chen is named on 1 patent: “System for Thermal Testing a Wafer Chuck and Methods for Performing the Same.” The invention describes a thermal test vehicle with a substrate and thermal probes. A vehicle controller manages substrate heating through the probes and stores the temperature data they generate.
Career Highlights
Chen is associated with Taiwan Semiconductor Manufacturing Company Ltd. His patent focuses on measuring and controlling temperature during wafer-chuck testing, supporting the evaluation of semiconductor manufacturing equipment.
Collaborations
Chen’s listed coworker is Huang Tang Peng. The patent information identifies their connection but does not specify the nature of their collaboration.
Conclusion
Jian Cheng Chen’s patent work centers on a system for thermal testing wafer chucks, reflecting an engineering focus relevant to semiconductor manufacturing.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile