The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 23, 2026
Filed:
Feb. 16, 2024
Applicant:
Taiwan Semiconductor Manufacturing Company Limited, Hsinchu, TW;
Inventors:
Assignee:
Taiwan Semiconductor Manufacturing Company Limited, Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 31/28 (2006.01); G01K 13/00 (2021.01);
U.S. Cl.
CPC ...
G01R 31/2875 (2013.01); G01K 13/00 (2013.01);
Abstract
A system for testing a wafer chuck includes: a thermal test vehicle (TTV) that includes a substrate and thermal probes disposed on the substrate; and a vehicle controller configured to control heating of the substrate by the thermal probes and to store temperature data generated by the thermal probes.
Wang, Chia. (2026). System for thermal testing a wafer chuck and methods for performing the same (U.S. Patent No. 12663461). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12663461
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile