This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Huang Tang Peng and Thermal Testing Innovation
Introduction
Huang Tang Peng is an inventor associated with Hsinchu, Taiwan. His patent work addresses thermal testing of wafer chucks, a component used in semiconductor manufacturing.
Latest Patents
The provided information lists one patent for Huang Tang Peng: “System for Thermal Testing a Wafer Chuck and Methods for Performing the Same.” The invention describes a thermal test vehicle with a substrate and thermal probes. A vehicle controller manages substrate heating through the probes and stores the temperature data they generate. This approach supports the evaluation of wafer chuck thermal performance.
Career Highlights
Huang Tang Peng is associated with Taiwan Semiconductor Manufacturing Company Limited. His listed patent reflects work on testing technology relevant to semiconductor equipment. The supplied information credits him with 1 patent.
Collaborations
Jian Cheng Chen is identified as a coworker. The available details do not specify the nature of their collaboration on the patent.
Conclusion
Huang Tang Peng’s listed invention focuses on a controlled, probe-based system for measuring wafer chuck temperatures, contributing to the development and evaluation of semiconductor testing methods.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile