This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Tong Hsing Electronic Industries, Ltd.. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Jia-Zheng Xu and Power Component Submount Technology.
Introduction
Jia-Zheng Xu is an inventor based in Taoyuan, Taiwan, and works at Tong Hsing Electronic Industries, Ltd. His patent work includes a design for a power component submount and a method for manufacturing it. Xu is associated with 1 patent.
Latest Patents
Xu’s patent, “Power Component Submount and Manufacturing Method Thereof,” describes a submount built around a ceramic substrate. A sputtering layer is formed on the substrate, with a conductive block placed on an electroplating portion of that layer. Three electroless plating layers are stacked on the conductive block, using either gold, palladium, and gold, or nickel, palladium, and gold. The outermost layer is designed to provide a mounting surface for a power component.
Career Highlights
Xu’s listed invention addresses the structure and manufacture of a submount for mounting power components. The patent describes how the ceramic substrate, sputtering layer, conductive block, and plating layers are arranged to form the component-supporting structure.
Collaborations
Xu’s listed coworkers include Jhih-wei Lai and Chun-chieh Liao.
Conclusion
Jia-Zheng Xu’s patent documents a layered ceramic submount design intended to support the mounting of power components.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile