Hsin Chu, Taiwan

Jia-ren Chen

This inventor holds 1 USPTO granted patent. Top assignee: TSMC-Acer Semiconductor Manufacturing Corporation. Active years: 2001.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Jia-ren Chen. Retrieved from https://idiyas.com/inventor/jia-ren-chen-1133ugnj

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 6.0

ph-index = 1

Forward Citations = 3(Granted Patents)


Company Filing History:


Years Active: 2001

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1 patent (USPTO):Explore Patents

Title: Jia-ren Chen: Innovator in Semiconductor Technology

Introduction

Jia-ren Chen is a notable inventor based in Hsin Chu, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly through his innovative methods in fabricating poly-spacers.

Latest Patents

Jia-ren Chen holds a patent for a "Method for fabricating poly-spacers." This method involves several steps, including forming an undoped first polysilicon layer on a semiconductor substrate, performing ion implantations at different angles to introduce impurities, and etching the polysilicon layers to create spacers. This invention plays a crucial role in enhancing the performance and reliability of semiconductor devices.

Career Highlights

Jia-ren Chen is currently employed at TSMC-Acer Semiconductor Manufacturing Corporation, where he applies his expertise in semiconductor fabrication. His work has been instrumental in advancing the technology used in modern electronic devices.

Collaborations

Some of his notable coworkers include Shiou-han Liaw and Yau-feng Lo, who collaborate with him on various projects within the semiconductor industry.

Conclusion

Jia-ren Chen's contributions to semiconductor technology through his innovative patent demonstrate his commitment to advancing the field. His work continues to impact the industry positively.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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