Company Filing History:
Years Active: 2013
Title: Ji Yeon Yu: Innovator in Semiconductor Technology
Introduction
Ji Yeon Yu is a notable inventor based in Seongnam-si, South Korea. He has made significant contributions to the field of semiconductor technology, particularly through his innovative designs that enhance electrical performance.
Latest Patents
Ji Yeon Yu holds 1 patent for a groundbreaking invention titled "Package in Package Semiconductor Device with Film Over Wire." This invention presents multiple embodiments of a package-in-package semiconductor device that includes shortened electrical signal paths to optimize electrical performance. The semiconductor device features a substrate with a conductive pattern formed on it. In each embodiment, a semiconductor package and one or more semiconductor dies are vertically stacked upon the substrate, establishing electrical communication with the conductive pattern. Notably, certain embodiments allow for a semiconductor die to be fully or partially covered with a film-over-wire, enhancing its functionality. Additionally, the vertically stacked electronic components are covered with a package body that partially covers the substrate.
Career Highlights
Ji Yeon Yu is currently employed at Amkor Technology, Inc., a leading provider of semiconductor packaging and test services. His work at Amkor has positioned him as a key player in advancing semiconductor technologies.
Collaborations
Throughout his career, Ji Yeon Yu has collaborated with talented individuals such as Chan Ha Hwang and Eun Sook Sohn, who contribute to the innovative environment at Amkor Technology.
Conclusion
Ji Yeon Yu's contributions to semiconductor technology through his patent and work at Amkor Technology, Inc. highlight his role as an influential inventor in the industry. His innovative designs continue to pave the way for advancements in electrical performance.