Amkor Technology, Inc.

Ji Yeon Yu

Byong Jin Kim

Min Woo Lee

Eun Sook Sohn

Chan Ha Hwang

Ho Choi

In accordance with the present invention, there is provided multiple embodiments of a package-in-package semiconductor device including shortened electrical signal paths to optimize electrical performance. The semiconductor device comprises a substrate having a conductive pattern formed thereon. In each embodiment of the semiconductor device, a semiconductor package and one or more semiconductor dies are vertically stacked upon the substrate, and placed into electrical communication with the conductive pattern thereof. In certain embodiments, a semiconductor die which is electrically connected to the conductive pattern of the substrate may be fully or partially covered with a film-over-wire. Additionally, in each embodiment of the semiconductor device, the vertically stacked electronic components thereof may be covered with a package body which also partially covers the substrate.

Growing community of inventors

Seongnam-si, South Korea

Ji Yeon Yu