This inventor holds 1 USPTO granted patent. Top assignee: Advanced Semiconductor Engineering, Inc.. Active years: 2002.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2002
Title: Ji Ping Teng: Innovator in Semiconductor Technology
Introduction
Ji Ping Teng is a notable inventor based in Fengshan, Taiwan. He has made significant contributions to the field of semiconductor technology. His innovative work has led to the development of a unique adhesive pattern that enhances the attachment of semiconductor chips to substrates.
Latest Patents
One of Ji Ping Teng's key patents is titled "Adhesive pattern for attaching semiconductor chip onto substrate." This patent describes an adhesive pattern designed for use on non-uniform substrates. The double-k pattern includes a longest major line and four shorter lines connected to it. This design allows for effective attachment of semiconductor chips, particularly in areas where the substrate has a conductive circuit and a solder mask.
Career Highlights
Ji Ping Teng is currently employed at Advanced Semiconductor Engineering, Inc. His work at this company has allowed him to focus on advancing semiconductor technologies. With a total of 1 patent, he has established himself as a valuable contributor to the industry.
Collaborations
Ji Ping Teng collaborates with Fu Tang Chu, who is also involved in semiconductor research and development. Their partnership has fostered innovation and progress in their projects.
Conclusion
Ji Ping Teng's contributions to semiconductor technology through his innovative adhesive pattern demonstrate his expertise and commitment to advancing the field. His work continues to influence the industry positively.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile