The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 05, 2002
Filed:
Nov. 27, 2001
Fu Tang Chu, Fengshan, TW;
Ji Ping Teng, Fengshan, TW;
Advanced Semiconductor Engineering, Inc., Kaoshiung, TW;
Abstract
An adhesive pattern for attaching a semiconductor chip onto a non-uniform substrate is disclosed. The adhesive pattern comprises a double-k pattern formed on the substrate. The double-k pattern includes a longest major line and four shorter lines connected to the major line. The non-uniform substrate has a conductive circuit and a solder mask formed on the substrate including the circuit. The substrate has a die covering region for receiving the semiconductor chip. The conductive circuit of the substrate comprises a plurality of conductive traces unequally distributed on the die covering region. The double-k adhesive pattern of the present invention is applied onto the non-uniform substrate by a dispenser in a manner that the area on the substrate defined between the major line and the border of the die covering region has a trace density lower than the other area on the substrate.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile