Ji-Han Ko

Title: The Innovative Contributions of Ji-Han Ko

Introduction

Ji-Han Ko is a prominent inventor based in Hwaseong-si, South Korea. He has made significant contributions to the field of semiconductor technology, holding a total of 9 patents. His work has been instrumental in advancing the efficiency and functionality of semiconductor packages.

Latest Patents

One of Ji-Han Ko's latest patents involves a semiconductor package that includes a lower semiconductor chip and a stack of semiconductor chips positioned in a first direction perpendicular to the top surface of the lower semiconductor chip. This innovative design features connection bumps located between the lower semiconductor chip and the bottommost semiconductor chip, as well as between the semiconductor chips themselves. Additionally, a protection layer covers the lateral surface of each connection bump, while a mold layer is applied to the lower semiconductor chip, covering the lateral surfaces of the semiconductor chips. This mold layer extends between the bottommost semiconductor chip and the lower semiconductor chip, providing enhanced structural integrity. Another notable patent focuses on a carrier substrate and a packaging method that includes a first layer, a second layer, and a first glue layer that is removably attached to the first layer.

Career Highlights

Ji-Han Ko is currently employed at Samsung Electronics Co., Ltd., where he continues to innovate and develop cutting-edge technologies. His work at Samsung has positioned him as a key player in the semiconductor industry, contributing to the company's reputation for excellence in technology.

Collaborations

Throughout his career, Ji-Han Ko has collaborated with talented individuals such as Won-keun Kim and Kyung-suk Oh. These collaborations have fostered a creative environment that encourages the exchange of ideas and the development of groundbreaking technologies.

Conclusion

Ji-Han Ko's contributions to semiconductor technology are noteworthy and reflect his dedication to innovation. His patents and work at Samsung Electronics Co., Ltd. demonstrate his commitment to advancing the field and improving the efficiency of semiconductor packages.