The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 28, 2021
Filed:
May. 29, 2019
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Inventors:
Ji-Han Ko, Hwaseong-si, KR;
Wonkeun Kim, Hwaseong-si, KR;
Assignee:
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/673 (2006.01); H01L 21/50 (2006.01); C03C 27/06 (2006.01); B32B 17/06 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/673 (2013.01); B32B 17/06 (2013.01); C03C 27/06 (2013.01); H01L 21/50 (2013.01); H01L 24/94 (2013.01);
Abstract
A carrier substrate and a packaging method, the carrier substrate including a first layer; a second layer; and a first glue layer between the first layer and the second layer, wherein the first glue layer is removably attached to the first layer.
Ko, Ji-Han. (2021). Carrier substrate and packaging method using the same (U.S. Patent No. 11211273). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11211273
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile