Jeungdae Kim

Title: Jeungdae Kim: Innovator in Semiconductor Technology

Introduction

Jeungdae Kim is a notable inventor based in Gimpo, South Korea. He has made significant contributions to the field of semiconductor technology, particularly through his innovative patent.

Latest Patents

Jeungdae Kim holds a patent for a semiconductor device package assembly and methods of manufacture. This patent describes a semiconductor device package that includes a die attach paddle with a first and second surface. The package features a semiconductor die coupled with the first surface of the die attach paddle. Additionally, it incorporates a direct-bonded-metal (DBM) substrate, which consists of a ceramic layer and two metal layers. The design ensures that the second metal layer is electrically isolated from the first metal layer by the ceramic layer, enhancing the functionality of the semiconductor device package.

Career Highlights

Jeungdae Kim is currently employed at Semiconductor Components Industries, LLC, where he continues to advance his work in semiconductor technology. His expertise and innovative approach have positioned him as a valuable asset in the industry.

Collaborations

Some of his coworkers include Seungwon Im and Oseob Jeon, who contribute to the collaborative environment that fosters innovation at Semiconductor Components Industries, LLC.

Conclusion

Jeungdae Kim's contributions to semiconductor technology through his patent demonstrate his commitment to innovation in the field. His work continues to influence advancements in semiconductor device packaging.