The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 18, 2025
Filed:
Mar. 27, 2023
Semiconductor Components Industries, Llc, Scottsdale, AZ (US);
Seungwon Im, Bucheon, KR;
Oseob Jeon, Seoul, KR;
Dongwook Kang, Bucheon, KR;
Youngsun Ko, Incheon, KR;
Jeungdae Kim, Gimpo, KR;
Changsun Yun, Seoul, KR;
Jihwan Kim, Seoul, KR;
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, Scottsdale, AZ (US);
Abstract
In a general aspect, an electronic device assembly includes a substrate arranged in a plane. The substrate has a first side and a second side, the second side being opposite the first side. The assembly also includes a plurality of semiconductor die disposed on the first side of the substrate and at least one signal pin. The at least one signal pin includes a proximal end portion coupled with the first side of the substrate, a distal end portion, and a medial portion disposed between the proximal end portion and the distal end portion. The medial portion is pre-molded in a molding compound, the proximal end portion and the distal end portion exclude the molding compound. The at least one signal pin is arranged along a longitudinal axis that is orthogonal to the plane of the substrate.