This inventor holds 1 USPTO granted patent. Top assignee: STMicroelectronics. Active years: 2008.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2008
Title: Jerome Teysseyre: Semiconductor Packaging Inventor
Introduction
Jerome Teysseyre is an inventor associated with Lans-en-Vercors, France, and STMicroelectronics. His patent work concerns semiconductor packaging and leadframe design.
Latest Patents
Teysseyre is named on one patent, titled “Process for Fabricating a Semiconductor Package and Semiconductor Package with Leadframe.” The invention describes a flat metal leadframe with spaced-apart portions, some of which serve as electrical connection leads. Filling material occupies the spaces between those portions to form a plate. An integrated circuit chip is then attached to the leadframe, electrically connected to the leads, and encapsulated on the front side. Teysseyre’s record lists 1 patent.
Career Highlights
The available information associates Teysseyre with STMicroelectronics and identifies his patent contribution in semiconductor package fabrication. The described approach integrates leadframe preparation, chip attachment, electrical connections, and encapsulation into a package structure.
Collaborations
Jean-Luc Diot is identified as Teysseyre’s coworker. The supplied information does not specify whether Diot collaborated on this patent.
Conclusion
Jerome Teysseyre’s documented invention addresses the fabrication of semiconductor packages using a filled leadframe, highlighting his contribution to packaging technology at STMicroelectronics.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile