The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 15, 2008
Filed:
Apr. 19, 2004
Applicants:
Jean-luc Diot, Grenoble, FR;
Jerome Teysseyre, Lans En Vercors, FR;
Inventors:
Jean-Luc Diot, Grenoble, FR;
Jerome Teysseyre, Lans En Vercors, FR;
Assignee:
STMicroelectronics S.A., Montrouge, FR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01);
U.S. Cl.
CPC ...
Abstract
A semiconductor package includes a flat metal leadframe including spaced apart portions, at least some of which constitute electrical connection leads. A filling material fills the spaces that separate the spaced apart portions of the leadframe to form a plate before fastening an integrated circuit chip to the front of the leadframe. Electrical connections are made between the chip and the electrical connection leads. The chip is then encapsulated on the front of the leadframe using a formed or attached encapsulant.