Jeroen Haneveld

Title: Jeroen Haneveld: Innovator in Substrate Bonding Technologies

Introduction

Jeroen Haneveld is a notable inventor based in Lochem, Netherlands. He has made significant contributions to the field of substrate bonding technologies, holding a total of 4 patents. His innovative methods have advanced the way substrates are bonded and electrically connected in various applications.

Latest Patents

Haneveld's latest patents include a method for forming an electrically conductive via in a substrate. This method involves creating a through hole in a first substrate and bringing a second substrate into contact with it. The process includes filling the hole with an electrically conductive material through electroplating, ensuring a high-quality bond between the substrates. Another significant patent is a method of bonding two substrates using an intermediate thin film metal layer. This method enhances the bonding strength and is applicable to various materials, including glass, silicon, and ceramics.

Career Highlights

Throughout his career, Haneveld has worked with several companies, including Berkin B.V. and Micronit Microfluidics B.V. His experience in these organizations has allowed him to refine his skills and contribute to innovative projects in the field of microfluidics and substrate technology.

Collaborations

Haneveld has collaborated with notable professionals in his field, including Theodorus Simon Josef Lammerink and Marcel Dijkstra. These collaborations have fostered a creative environment that has led to the development of groundbreaking technologies.

Conclusion

Jeroen Haneveld's contributions to substrate bonding technologies demonstrate his innovative spirit and commitment to advancing the field. His patents reflect a deep understanding of materials and processes that are essential for modern applications.