Jeong-O Ha

Title: Innovations of Jeong-O Ha

Introduction

Jeong-O Ha is a notable inventor based in Asan-si, South Korea. He has made significant contributions to the field of semiconductor technology, holding a total of 4 patents. His work primarily focuses on methods for fabricating advanced chip systems.

Latest Patents

One of his latest patents is titled "Method for fabricating a flip chip system in package." This invention outlines a process that involves preparing a printed circuit board (PCB) strip with multiple individual PCBs. The method includes stacking semiconductor chips and forming an encapsulant on the PCB to create a semiconductor chip stack structure. A critical aspect of this invention is the testing of the semiconductor chips to ensure they meet specific standards before proceeding with the flip chip bonding process.

Another significant patent is "Chip stack structure having shielding capability and system-in-package module using the same." This invention describes a chip stack structure that includes a wiring substrate with a ground layer. It features a first chip attached to the substrate and a shield plate designed to cover the chip and its bonding wires. This innovative design enhances the shielding capability of the chip stack structure, improving its overall performance.

Career Highlights

Jeong-O Ha is currently employed at Samsung Electronics Co., Ltd., where he continues to develop cutting-edge technologies in the semiconductor industry. His work has contributed to advancements in system-in-package solutions, which are crucial for modern electronic devices.

Collaborations

He has collaborated with notable colleagues, including Heung-Kyu Kwon and Tae-Hun Kim, to further enhance the innovations in his field.

Conclusion

Jeong-O Ha's contributions to semiconductor technology through his patents and work at Samsung Electronics Co., Ltd. highlight his role as a key innovator in the industry. His inventions are paving the way for more efficient and advanced electronic systems.