The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 25, 2010
Filed:
Oct. 12, 2006
Houng-kyu Kwon, Gyeonggi-do, KR;
Jeong-o Ha, Asan-si, KR;
Houng-Kyu Kwon, Gyeonggi-do, KR;
Jeong-O Ha, Asan-si, KR;
Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;
Abstract
A chip stack structure having a shielding capability may comprise a wiring substrate, the wiring substrate including a ground layer. The structure may also comprise a first chip attached on an upper surface of the wiring substrate and electrically connected to the ground layer. The structure may also comprise a plurality of first bonding wires which electrically connect the first chip to the wiring substrate. The structure may also comprise a shield plate attached to the first chip and detached from at least one of the plurality of first bonding wires, the shield plate being configured to cover the first chip and at least one of the plurality of first bonding wires. The structure may also comprise a grounding wire which connects the shield plate to the ground layer of the wiring substrate. The structure may also comprise a second chip attached to and supported by the shield plate. The structure may also comprise a plurality of second bonding wires which connect the second chip directly or via the shield plate to the wiring substrate.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile