Jens Goerlich

Title: Jens Goerlich: Innovator in Semiconductor Technology

Introduction

Jens Goerlich is a prominent inventor based in Bueren, Germany, known for his contributions to semiconductor technology. With a total of 2 patents, he has made significant advancements in the field, particularly in the fabrication of circuit substrate assemblies and power electronics modules.

Latest Patents

Goerlich's latest patents include a device that incorporates a semiconductor chip and a carrier, along with a fabrication method. This method involves providing a semiconductor chip with exposed semiconductor material on its first surface, which is then placed over a carrier. An electrically conductive material is arranged between the semiconductor chip and the carrier, and heat is applied to create a secure attachment. Another notable patent focuses on a method for fabricating a circuit substrate assembly and a power electronics module that features an anchoring structure. This structure is designed to produce a temperature-stable solder bond, enhancing the reliability of power semiconductor modules.

Career Highlights

Jens Goerlich is currently associated with Infineon Technologies AG, a leading company in semiconductor solutions. His work has been instrumental in developing innovative technologies that improve the efficiency and performance of electronic devices.

Collaborations

Throughout his career, Goerlich has collaborated with notable colleagues, including Olaf Hohlfeld and Reinhold Bayerer, contributing to various projects that push the boundaries of semiconductor technology.

Conclusion

Jens Goerlich's innovative work in semiconductor technology has led to significant advancements in the field, showcasing his expertise and dedication to improving electronic systems. His contributions continue to influence the industry and pave the way for future innovations.