The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 28, 2014

Filed:

Oct. 08, 2009
Applicants:

Hannes Eder, Villach, AT;

Ivan Nikitin, Regensburg, DE;

Manfred Schneegans, Vaterstetten, DE;

Jens Goerlich, Bueren, DE;

Karsten Guth, Soest, DE;

Alexander Heinrich, Regensburg, DE;

Inventors:

Hannes Eder, Villach, AT;

Ivan Nikitin, Regensburg, DE;

Manfred Schneegans, Vaterstetten, DE;

Jens Goerlich, Bueren, DE;

Karsten Guth, Soest, DE;

Alexander Heinrich, Regensburg, DE;

Assignee:

Infineon Technologies AG, Neubiberg, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 21/30 (2006.01); H01L 21/46 (2006.01); H01L 21/44 (2006.01); H01L 21/50 (2006.01); H01L 21/60 (2006.01);
U.S. Cl.
CPC ...
Abstract

A description is given of a method. In one embodiment the method includes providing a semiconductor chip with semiconductor material being exposed at a first surface of the semiconductor chip. The semiconductor chip is placed over a carrier with the first surface facing the carrier. An electrically conductive material is arranged between the semiconductor chip and the carrier. Heat is applied to attach the semiconductor chip to the carrier.


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