Munich, Germany

Jens Brandenburg


Average Co-Inventor Count = 6.7

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2019-2024

Loading Chart...
4 patents (USPTO):Explore Patents

Title: Jens Brandenburg: Innovator in Semiconductor Technology

Introduction

Jens Brandenburg is a prominent inventor based in Munich, Germany. He has made significant contributions to the field of semiconductor technology, holding a total of 4 patents. His work focuses on enhancing the efficiency and functionality of semiconductor devices.

Latest Patents

Brandenburg's latest patents include innovative methods for manufacturing semiconductor devices. One of his notable inventions is a semiconductor device that features a bonding pad metal layer structure. This method involves forming a wiring metal layer structure and a dielectric layer structure directly on it. The bonding pad metal layer structure is arranged, at least partially, directly on the dielectric layer structure. The layer thickness of the dielectric layer structure is designed to range from 1% to 30% of the layer thickness of the wiring metal layer structure. This design ensures that the wiring metal layer structure and the bonding pad metal structure are electrically connected through openings in the dielectric layer structure.

Career Highlights

Jens Brandenburg is currently employed at Infineon Technologies AG, a leading company in semiconductor solutions. His work at Infineon has allowed him to push the boundaries of semiconductor technology and contribute to advancements in the industry.

Collaborations

Throughout his career, Brandenburg has collaborated with notable colleagues, including Oliver Humbel and Josef-Georg Bauer. These collaborations have fostered innovation and have been instrumental in the development of new technologies in the semiconductor field.

Conclusion

Jens Brandenburg is a key figure in semiconductor innovation, with a focus on improving device efficiency through his patented technologies. His contributions continue to shape the future of semiconductor applications.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…