Location History:
- Chu-Tong Town, TW (2017 - 2018)
- Chu-Tong Township, TW (2018)
- Chu-Tong Town, Hsinchu County, TW (2018)
Company Filing History:
Years Active: 2017-2018
Title: Jeng-Jyi Hwang: Innovator in Chemical Mechanical Polishing Technologies
Introduction
Jeng-Jyi Hwang is a prominent inventor based in Chu-Tong Town, Taiwan. He has made significant contributions to the field of chemical mechanical polishing (CMP) with a total of 4 patents to his name. His work focuses on enhancing the efficiency and effectiveness of wafer polishing systems.
Latest Patents
Among his latest innovations is the "Multi-point chemical mechanical polishing end point detection system and method of using." This invention features a wafer polishing system that includes a platen designed to rotate in one direction, while a polishing head holds and rotates the wafer in another direction. The system is equipped with an optical sensing mechanism that detects the thickness of the wafer at two distinct locations on the platen, allowing for precise control during the polishing process.
Another notable patent is the "pH-adjuster free chemical mechanical planarization slurry." This invention outlines a method for creating a CMP slurry that does not require pH-adjusters, which are typically added solely to modify the pH of the slurry. By utilizing a chelating agent that bonds to metallic ions, the method adjusts the pH of the slurry efficiently, reducing both cost and complexity.
Career Highlights
Jeng-Jyi Hwang is currently employed at Taiwan Semiconductor Manufacturing Company Limited, where he continues to innovate in the semiconductor manufacturing sector. His expertise in CMP technologies has positioned him as a key player in the industry.
Collaborations
Throughout his career, Jeng-Jyi has collaborated with notable colleagues, including Chi-Ming Yang and Jiann Lih Wu. These partnerships have fostered a collaborative environment that enhances innovation and development in their field.
Conclusion
Jeng-Jyi Hwang's contributions to chemical mechanical polishing technologies demonstrate his commitment to advancing semiconductor manufacturing processes. His innovative patents reflect a deep understanding of the complexities involved in wafer polishing, making him a valuable asset to the industry.