Jen-Kon Chen

Title: The Innovations of Jen-Kon Chen

Introduction

Jen-Kon Chen is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly in the development of interconnection structures. With a total of 2 patents, his work has had a considerable impact on the industry.

Latest Patents

One of his latest patents is titled "Interconnection structure and fabrication method thereof." This invention involves the formation of a first organic low-k material layer, a stress redistribution layer, and a second organic low-k dielectric layer in sequence over a substrate. An opening is then created in these layers, which is subsequently filled with a conductive material to establish an interconnection structure. The stress redistribution layer is designed to have a heat expansion coefficient that is closer to that of the substrate, while differing significantly from the coefficients of the first and second organic low-k material layers.

Career Highlights

Jen-Kon Chen is currently employed at United Microelectronics Corporation, a leading company in the semiconductor industry. His work at this organization has allowed him to further his research and development efforts in innovative technologies.

Collaborations

Throughout his career, Jen-Kon Chen has collaborated with esteemed colleagues such as Chih-Chao Yang and Gwo-Shil Yang. These partnerships have contributed to the advancement of his projects and the overall success of their initiatives.

Conclusion

Jen-Kon Chen's contributions to semiconductor technology through his patents and collaborations highlight his role as an influential inventor in the field. His innovative approaches continue to shape the future of interconnection structures in electronics.