Jen-Chieh Wei

Title: Innovations by Inventor Jen-Chieh Wei

Introduction

Jen-Chieh Wei is a notable inventor based in Highlands Ranch, Colorado. He has made significant contributions to the field of materials science, particularly in the treatment of metal surfaces to enhance adhesion. With a total of 5 patents to his name, Wei's work has implications for various industries, including electronics and manufacturing.

Latest Patents

Wei's latest patents focus on methods of treating metal surfaces to improve bonding strength without altering the surface topography. One of his inventions relates to enhancing adhesion between treated metal surfaces and resin layers, which is crucial for the production of printed circuit boards (PCBs). His methods provide resistance to heat, moisture, and chemicals, making them particularly useful in high-density multilayer PCBs. Another patent addresses the treatment of smooth copper surfaces to increase adhesion to organic substrates, further advancing the manufacturing processes of PCBs.

Career Highlights

Throughout his career, Wei has worked with prominent companies such as Atotech Deutschland GmbH and Esionic Corporation. His experience in these organizations has allowed him to refine his expertise in surface treatment technologies and their applications in electronic manufacturing.

Collaborations

Wei has collaborated with talented individuals in his field, including Zhiming Liu and Steven Zhichao Shi. These partnerships have contributed to the development of innovative solutions in surface treatment and adhesion technologies.

Conclusion

Jen-Chieh Wei's contributions to the field of materials science and surface treatment have paved the way for advancements in the manufacturing of printed circuit boards. His innovative methods enhance adhesion and bonding strength, making significant impacts in various applications.