The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 04, 2012
Filed:
Dec. 01, 2009
Werner G. Kuhr, Denver, CO (US);
Steven Z. Shi, Highlands Ranch, CO (US);
Jen-chieh Wei, Highlands Ranch, CO (US);
Zhiming Liu, Englewood, CO (US);
Lingyun Wei, Englewood, CO (US);
Werner G. Kuhr, Denver, CO (US);
Steven Z. Shi, Highlands Ranch, CO (US);
Jen-Chieh Wei, Highlands Ranch, CO (US);
Zhiming Liu, Englewood, CO (US);
Lingyun Wei, Englewood, CO (US);
Atotech Deutschland GmbH, Berlin, DE;
Abstract
Embodiments of the present invention provide methods of treating a surface of a substrate. In one particular aspect, embodiments of the present invention provide methods of treating a surface of a substrate that promote binding of one or more metal elements to the surface. According to some embodiments of the invention, films are formed on any conducting, semiconductive or non-conductive surface, by thermal reaction of molecules containing reactive groups in an organic solvent or in aqueous solution. The thermal reaction may be produced under a variety of conditions. In another aspect, the present invention provides a printed circuit board, comprising: at least one substrate; a layer of organic molecules attached to the at least one substrate; and a metal layer atop said layer of organic molecules.