Jeffrey Chang

Title: The Innovative Contributions of Jeffrey Chang

Introduction

Jeffrey Chang is a prominent inventor based in Hsin-Chu, Taiwan. He has made significant contributions to the field of semiconductor packaging, holding a total of 3 patents. His work focuses on enhancing the efficiency and functionality of electronic devices through innovative packaging solutions.

Latest Patents

One of Jeffrey's latest patents is titled "Fan-out POP structure with inconsecutive polymer layer." This patent describes a package that includes a device die, a molding material that encapsulates at least a portion of the device die, and a through-via that penetrates the molding material. Additionally, the package features a dielectric layer that contacts both the through-via and the molding material, along with a die attach film that is affixed to the backside of the device die. This die attach film includes a portion that extends into the dielectric layer.

Another notable patent is "Fan-out packages and methods of forming same." This invention outlines a device package that consists of a semiconductor die, a molding compound that extends along the sidewalls of the semiconductor die, and a planarizing polymer layer that covers the molding compound. The molding compound contains first fillers, while the planarizing polymer layer incorporates second fillers that are smaller than the first. Furthermore, the device package includes one or more fan-out redistribution layers (RDLs) that are electrically connected to the semiconductor die, extending beyond the edges of the semiconductor die onto the top surface of the planarizing polymer layer.

Career Highlights

Jeffrey Chang is currently employed at Taiwan Semiconductor Manufacturing Company Ltd., a leading firm in the semiconductor industry. His work at this company has allowed him to develop and refine his innovative ideas, contributing to advancements in semiconductor technology.

Collaborations

Throughout his career, Jeffrey has collaborated with notable colleagues, including Jing-Cheng Lin and Tsei-Chung Fu. These collaborations have fostered a creative environment that encourages the exchange of ideas and the development of cutting-edge technologies.

Conclusion

Jeffrey Chang's contributions to semiconductor packaging through his innovative patents have significantly impacted the industry. His work continues to pave the way for advancements in electronic device efficiency and functionality.