Je-Ming Kuo

Title: Innovations by Inventor Je-Ming Kuo

Introduction

Je-Ming Kuo is an accomplished inventor based in Hsinchu, Taiwan, known for his contributions to the semiconductor industry. With a total of four patents to his name, Kuo continues to push the boundaries of technology through innovative processes and techniques.

Latest Patents

One of Kuo's latest patents is a cyclic spin-on coating process for forming dielectric material. This patent is significant for its application in semiconductor devices, where it outlines methods for creating a dielectric material layer using a two-phase spin-coating technique followed by thermal annealing. This process enhances the quality and efficiency of dielectric layers in advanced semiconductor applications.

Another notable patent is for a semiconductor device featuring isolation fins. This innovation includes a method of manufacturing semiconductor devices with isolation structures between semiconductor regions, improving device integrity while allowing for a more compact design. By utilizing diverse isolation structures with different spacings, Kuo’s invention minimizes damage risks and improves device performance.

Career Highlights

Je-Ming Kuo is currently employed at Taiwan Semiconductor Manufacturing Company Limited (TSMC), a leader in semiconductor manufacturing. His work at TSMC highlights his role in advancing semiconductor technology and his commitment to research and development in this critical field.

Collaborations

Throughout his career, Kuo has collaborated with notable colleagues such as Yen-Chun Huang and Chih-Tang Peng. These partnerships have enabled him to enhance his research efforts and contribute to significant advancements in semiconductor technologies.

Conclusion

As a respected inventor in the semiconductor field, Je-Ming Kuo's work is instrumental in driving innovation forward. His patents not only reflect his expertise but also serve as a foundation for further advancements in semiconductor manufacturing and technology. With a focus on improving device performance and manufacturing processes, Kuo’s contributions are likely to shape the future of the industry.