The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 20, 2022

Filed:

May. 30, 2018
Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;

Inventors:

Je-Ming Kuo, Hsinchu, TW;

Yen-Chun Huang, New Taipei, TW;

Chih-Tang Peng, Zhubei, TW;

Tien-I Bao, Taoyuan, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); H01L 21/762 (2006.01); H01L 29/06 (2006.01); H01L 21/311 (2006.01); H01L 21/8234 (2006.01); H01L 21/768 (2006.01); B05D 1/00 (2006.01); B05D 1/38 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02282 (2013.01); H01L 21/0223 (2013.01); H01L 21/02126 (2013.01); H01L 21/02164 (2013.01); H01L 21/02323 (2013.01); H01L 21/02348 (2013.01); H01L 21/31111 (2013.01); H01L 21/76224 (2013.01); H01L 21/823481 (2013.01); H01L 29/0649 (2013.01); B05D 1/005 (2013.01); B05D 1/38 (2013.01); H01L 21/02255 (2013.01); H01L 21/76825 (2013.01); H01L 21/76826 (2013.01); H01L 21/76828 (2013.01); H01L 21/76832 (2013.01);
Abstract

The present disclosure is generally related to semiconductor devices, and more particularly to a dielectric material formed in semiconductor devices. The present disclosure provides methods for forming a dielectric material layer by a cyclic spin-on coating process. In an embodiment, a method of forming a dielectric material on a substrate includes spin-coating a first portion of a dielectric material on a substrate, curing the first portion of the dielectric material on the substrate, spin-coating a second portion of the dielectric material on the substrate, and thermal annealing the dielectric material to form an annealed dielectric material on the substrate.


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