Greenville, WI, United States of America

Jay Daniel Hodson

This inventor holds 17 USPTO granted patents, plus 2 CIPO patents and 1 EPO patent, primarily in Flexible Packaging. Top assignees: Bemis Company, Inc., Pechiney Emballage Flexible Europe, American National Can Company. Active years: 1999-2020.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Jay Daniel Hodson. Retrieved from https://idiyas.com/inventor/jay-daniel-hodson

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 17

% Patents Active = 64.7

CIPO Patents = 2 (Patent Applications = 2)

EPO Patents = 1 (Patent Applications = 1)

Average Co-Inventor Count = 2.9

ph-index = 4

Forward Citations = 89(Granted Patents)

Location History:

Appleton, WI (US) (2000 - 2004)
Greenville, WI (US) (1999 - 2013)
Hortonville, WI (US) (2018 - 2020)

Company Filing History:

Pechiney Emballage Flexible Europe

patents

2 out of 173

American National Can Company

Years Active: 1999-2020

Loading Chart...

Areas of Expertise:

Multilayer Pouch

Heat-Shrinkable Layer

Bag-In-Box Package

Flexible Packaging

Microwave Cooking Containers

Transparent Packaging

Laminated Film Structures

Tear Tape

Food Packaging

Embossed Liquid Containment

Self-Closing Package

17 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 10759578 - Multilayer pouch with heat-shrinkable layer (2020-09-01),

2. 10654635 - Transparent retail bag-in-box package (2020-05-19),

3. 10569950 - Self-venting bag-in-box package (2020-02-25),

4. 10532856 - Self-closing manually re-openable package (2020-01-14),

5. 10486885 - Flexible package with embossed liquid containment cells (2019-11-26),

6. 10071841 - Scored package (2018-09-11),

7. 8497455 - Microwave cooking containers with shielding (2013-07-30),

8. 7981492 - [object Object] (2011-07-19),

9. 7008677 - Film structures and packages therefrom useful for packaging respiring food products (2006-03-07),

10. 6815057 - Laminated thermoformable film structures useful for packaging food products (2004-11-09),

11. 6753054 - Heat shrinkable film structures with improved sealability and toughness (2004-06-22),

12. 6749877 - Tear tape for plastic packaging (2004-06-15),

13. 6528134 - Non-wax packaging film (2003-03-04),

14. 6416841 - Tear tape for plastic packaging (2002-07-09),

15. 6316036 - Tear tape for plastic packaging (2001-11-13),

Title: **The Innovative Journey of Jay Daniel Hodson**

Introduction

Jay Daniel Hodson is a prominent inventor based in Greenville, Wisconsin, renowned for his significant contributions to packaging technology. With a remarkable portfolio of 17 patents, Hodson has made considerable strides in developing innovative solutions that enhance product safety and usability.

Latest Patents

Among his recent patents, Hodson developed the **Multilayer pouch with heat-shrinkable layer**. This invention features a sophisticated design that includes a first wall, a second wall, and a product space intended to fully enclose the product. The first wall comprises advanced layers that offer improved shrinkage and stiffness properties, making it highly effective for packaging applications.

Another notable invention is the **Transparent retail bag-in-box package**. This innovative packaging incorporates a flexible thermoplastic bag contained within a polymeric box, designed for efficient product access and visual appeal. The package allows consumers to see the product, enhancing the retail experience.

Career Highlights

Hodson has a significant background in the packaging industry and has worked with notable companies such as Pechiney Emballage Flexible Europe and Bemis Company, Inc. His experience at these organizations has played a vital role in shaping his innovative approach to product packaging and design.

Collaborations

Throughout his career, Hodson has collaborated with influential figures in the field, including colleagues Peter M. Chen and Steven Andrew Willis. Their partnerships have contributed to the development of groundbreaking concepts and technologies within packaging and related industries.

Conclusion

Jay Daniel Hodson's inventive spirit and dedication to improving packaging solutions exemplify his status as a leading inventor in his field. His latest patents reflect his commitment to enhancing product safety, accessibility, and consumer experience. As he continues to innovate, Hodson's work will likely influence the packaging industry for years to come.

Profile summary based on public USPTO records.