Greenville, WI, United States of America

Jay Daniel Hodson


 

 

Average Co-Inventor Count = 2.9

ph-index = 4

Forward Citations = 87(Granted Patents)


Location History:

  • Appleton, WI (US) (2000 - 2004)
  • Greenville, WI (US) (1999 - 2013)
  • Hortonville, WI (US) (2018 - 2020)

Company Filing History:


Years Active: 1999-2020

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17 patents (USPTO):Explore Patents

Title: **The Innovative Journey of Jay Daniel Hodson**

Introduction

Jay Daniel Hodson is a prominent inventor based in Greenville, Wisconsin, renowned for his significant contributions to packaging technology. With a remarkable portfolio of 17 patents, Hodson has made considerable strides in developing innovative solutions that enhance product safety and usability.

Latest Patents

Among his recent patents, Hodson developed the **Multilayer pouch with heat-shrinkable layer**. This invention features a sophisticated design that includes a first wall, a second wall, and a product space intended to fully enclose the product. The first wall comprises advanced layers that offer improved shrinkage and stiffness properties, making it highly effective for packaging applications.

Another notable invention is the **Transparent retail bag-in-box package**. This innovative packaging incorporates a flexible thermoplastic bag contained within a polymeric box, designed for efficient product access and visual appeal. The package allows consumers to see the product, enhancing the retail experience.

Career Highlights

Hodson has a significant background in the packaging industry and has worked with notable companies such as Pechiney Emballage Flexible Europe and Bemis Company, Inc. His experience at these organizations has played a vital role in shaping his innovative approach to product packaging and design.

Collaborations

Throughout his career, Hodson has collaborated with influential figures in the field, including colleagues Peter M. Chen and Steven Andrew Willis. Their partnerships have contributed to the development of groundbreaking concepts and technologies within packaging and related industries.

Conclusion

Jay Daniel Hodson's inventive spirit and dedication to improving packaging solutions exemplify his status as a leading inventor in his field. His latest patents reflect his commitment to enhancing product safety, accessibility, and consumer experience. As he continues to innovate, Hodson's work will likely influence the packaging industry for years to come.

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