The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 11, 2018

Filed:

Jul. 03, 2013
Applicant:

Bemis Company, Inc., Neenah, WI (US);

Inventors:

Jordan R. Tracy, Appleton, WI (US);

Jay D. Hodson, Hortonville, WI (US);

Assignee:

Bemis Company, Inc., Neenah, WI (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B65D 33/00 (2006.01); B65D 75/58 (2006.01); B32B 3/26 (2006.01); B65D 75/00 (2006.01); B65D 75/30 (2006.01);
U.S. Cl.
CPC ...
B65D 75/5827 (2013.01); B32B 3/26 (2013.01); B65D 75/008 (2013.01); B65D 75/30 (2013.01); B65D 75/5866 (2013.01); B32B 2307/582 (2013.01); B32B 2439/46 (2013.01);
Abstract

A scored package is described. The first panel of the package comprises a multilayer film with an exterior layer having a nonlinear first score Sine and an interior layer having a linear second score line. The first score line and the second score fine are positioned non-parallel in a plane of the package such that the first score line intersects the second score line to form an opening in the package at the second score line when the exterior layer and the interior layer are separated. Separation of the exterior layer and the interior layer also forms an adhesive-free pour spout in the separated exterior layer. Various embodiments of various package configurations, score line configurations, multilayer film structures and methods of manufacturing are also described.


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