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For the Inventor, By the Inventor

Neenah, WI, United States of America

Bemis Company, Inc.

Calculating rank
USPTO Granted Patents = 130

% Expired Patents = 12.3



Trademarks = 43

Forward Citations = 1,514

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131 inventors (with patents filed for the assignee):

goldMedal Otacilio Teixeira Berbert (8 out of 21 patents)

silverMedal Jay Daniel Hodson (7 out of 17 patents)

bronzeMedal Gaylerd M Lieder (7 out of 7 patents)

4.  Jordan R Tracy (5 out of 5 patents)

5.  Ronald G Thrall (5 out of 6 patents)

6.  Kevin Philip Nelson (5 out of 28 patents)

7.  Xiangke Shi (4 out of 4 patents)

8.  Rishabh Jain (4 out of 10 patents)

9.  Donald C Schnabel (4 out of 4 patents)

10.  Roger Bannister (4 out of 5 patents)

11.  Eugene H Wolske (4 out of 5 patents)

12.  Robert E Odom (4 out of 4 patents)

13.  Barry A Cooper (4 out of 5 patents)

14.  Richard W Jacobs (4 out of 4 patents)

15.  Peter Chen (4 out of 45 patents)


Core Competencies:
Antimicrobial Films
Resealable Features
Heat-Seal Innovations
Flexible Packaging
Tamper-Evident
Microwave Containers
Peelable Packages
Multiwall Bags
Blister Components
Child-Resistant Packaging
Thermoformed Packaging
Printed Sheets

130 patents:

1. 11590472 - Methods and compositions for on-demand release of ClOgas from UV-activated chlorite ion (2023-02-28),
2. 11503948 - Ovenable package (2022-11-22),
3. 11465810 - Package having peel reseal feature (2022-10-11),
4. 11383908 - Tamper-evident reclosable packages (2022-07-12),
5. 11377278 - Printed sheet for thermoformed packaging (2022-07-05),
6. 11319131 - Sterilization pouch (2022-05-03),
7. 11318723 - Packaging films with improved hot-tack performance (2022-05-03),
8. 11279118 - Packaging film for high temperature materials (2022-03-22),
9. 11273969 - Peelable absorbent food package (2022-03-15),
10. 11247410 - Package for indicating heat-seal condition (2022-02-15),
11. 11224671 - Release of ClOgas from produce packaging film (2022-01-18),
12. 11203189 - Heat-seal lid with non-heat sealing layer and hydrophobic overcoat (2021-12-21),
13. 11167901 - Flexible resealable packages (2021-11-09),
14. 11167898 - Packaging film with product-release coating (2021-11-09),
15. 11136166 - Pouch with flexible self-sealing dispensing valve (2021-10-05),
Company Overview
Bemis Company, Inc., headquartered in Neenah, Wisconsin, specializes in advanced packaging technology. The company focuses on developing innovative solutions such as antimicrobial films, resealable features, and heat-seal innovations, catering to diverse industries. Bemis is recognized for its expertise in flexible packaging, tamper-evident designs, microwave containers, peelable packages, and multiwall bags, emphasizing safety and convenience in packaging applications. Its commitment to research and development positions Bemis as a leader in the packaging sector.
Profile summary synthesized from public USPTO records and patent filings.

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USPTO Data Jan 1 1976 - Nov 3 2026

Bemis Company, Inc. USPTO Patent Assignee Logo
130 Patents

#3 in Neenah, WI

#60 in Wisconsin

#2,988 in US

#6,184 in the World

Neenah, WI (US)
Neenah, WI, United States of America

Bemis Company, Inc.

Forward Citations = 1,514

131 inventors:

goldMedal Otacilio Teixeira Berbert (8 out of 21 patents)

silverMedal Jay Daniel Hodson (7 out of 17 patents)

bronzeMedal Gaylerd M Lieder (7 out of 7 patents)

4.  Jordan R Tracy (5 out of 5 patents)

5.  Ronald G Thrall (5 out of 6 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Bemis Company, Inc.. Retrieved from https://idiyas.com/company/bemis-company

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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