The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 01, 2020

Filed:

Feb. 24, 2016
Applicant:

Bemis Company, Inc., Neenah, WI (US);

Inventors:

Peter M. Chen, Appleton, WI (US);

Xiangke Shi, Neenah, WI (US);

Jay D. Hodson, Hortonville, WI (US);

Seamus A. Wedge, Neenah, WI (US);

Curtis R. Barr, Neenah, WI (US);

Assignee:

Bemis Company, Inc., Neenah, WI (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B65D 75/26 (2006.01); B32B 7/02 (2019.01); B65D 75/58 (2006.01); B65D 75/00 (2006.01);
U.S. Cl.
CPC ...
B65D 75/26 (2013.01); B32B 7/02 (2013.01); B65D 75/5833 (2013.01); B32B 2307/306 (2013.01); B32B 2307/308 (2013.01); B32B 2307/736 (2013.01); B65D 75/008 (2013.01);
Abstract

A multilayer pouch with heat-shrinkable layer is described. The pouch comprises a first wall; a second wall; a perimeter comprising a first edge and a second edge opposing the first edge; and a product space positioned between the first wall, the second wall, and the perimeter. The pouch is configured to fully enclose the product space. The first wall comprises a first wall first layer having a machine direction shrinkage value of greater than 5% shrink at 90° C., a first wall second layer having a machine direction Gurley stiffness force of at least 800 mgf and a machine direction shrinkage value at 90° C. of less than the machine direction shrinkage value of the first wall first layer at 90° C., a first wall pattern connection, and a first wall air inlet. The first wall first layer is interior the first wall second layer. Various embodiments of the pouch are also described.


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