Jason Jieping Zhang is a prominent inventor based in Chandler, AZ. He has made significant contributions to the field of semiconductor technology, holding a total of five patents. His work focuses on enhancing the efficiency and yield of semiconductor packaging.

Latest Patents

One of Jason's latest patents is titled "Package structure to enhance yield of TMI interconnections." This invention describes an apparatus that includes a substrate and a mold compound disposed on the substrate. The semiconductor die is embedded within the mold compound and is electrically coupled to lands on the substrate. Solder balls are arranged around the semiconductor die on the substrate, each having a solid coating that contains a cleaning agent to promote coalescence with other solder balls. Vias are formed in the mold compound to expose the solder balls and their coatings. In various embodiments, the outer edges of the mold compound have a smaller thickness than the regions between the vias and the semiconductor die. Additionally, micro-channels may exist between the solder balls and the mold compound.

Career Highlights

Jason Jieping Zhang is currently employed at Intel Corporation, a leading company in semiconductor manufacturing. His innovative work has contributed to advancements in packaging technology, which is crucial for the performance of electronic devices.

Collaborations

Throughout his career, Jason has collaborated with notable colleagues, including Thomas J De Bonis and Lilia May. These collaborations have

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