Intel Corporation

Jason Jieping Zhang

Carl L Deppisch

Edward Rudolph Prack

Ashay A Dani

Anna M Prakash

Mukul P Renavikar

Rajen S Sidhu

Lilia May

Thomas J De Bonis

Srinivasa R Aravamudhan

James C Matayabas

Chang Lin

Robert Starkston

Tian-An Chen

Song-Hua Shi

Lejun Wang

Juan Landeros

Katrina Certeza

An apparatus is described that includes a substrate and a mold compound disposed on the substrate. The semiconductor die is embedded within the mold compound and is electrically coupled to lands on the substrate. Solder balls are disposed around the semiconductor die on the substrate. Each of the solder balls have a solid coating thereon. The solid coating contains a cleaning agent to promote its solder ball's coalescence with another solder ball. Respective vias are formed in the mold compound that expose the solder balls and their respective solid coatings. In combined or alternate embodiments outer edges of the mold compound have smaller thickness than regions of the mold compound between the vias and the semiconductor die. In combined or alternate embodiments micro-channels exist between the solder balls and the mold compound.

Package structure to enhance yield of TMI interconnections

An article includes a mounting substrate, a passive component site on the mounting substrate, and an active component site on the mounting substrate. The article also includes a fluid flow barrier disposed local to the passive component site and spaced apart from the active component site. The fluid flow barrier can be a recess that resists fluid flow thereinto because of surface tension of the fluid when it meets the recess edge. The fluid flow barrier can include a boundary that diverts fluid flow due to the angle of the recess edge as the fluid approaches it. An embodiment also includes a packaging system that includes the article and at least one passive component. An embodiment also includes a method of assembling the article or the packaging system.

Local control of underfill flow on high density packages, packages and systems made therewith, and methods of making same

An electronic structure includes an electronic device coupled to a substrate by conductive bumps and ball limiting metallurgy (BLM). Underfill material having filler particles is disposed in a space between the electronic device and the substrate. A weight percentage of the filler particles is at least about 60%. A particle size of at least 90 wt % of the filler particles is less than about 2 &#x3bc;m and/or the filler particles are coated by an organic coupling agent. Once the underfill material is fully cured, its coefficient of thermal expansion is no more than 30 PPM/&#xb0; C., and its glass transition temperature is at least 100&#xb0; C., and its adhesion to a passivation layer of the electronic device, to the substrate and to the electronic device at its edges is such that the electronic structure passes standardized reliability tests without delamination of the ball limiting metallurgy.

Underfill material to reduce ball limiting metallurgy delamination and cracking potential in semiconductor devices

A marking is formed on an underfill between a die and a substrate.

Marking on underfill

Growing community of inventors

Chandler, AZ, United States of America

Jason Jieping Zhang