Jürgen Högerl

Title: Jürgen Högerl: Innovator in Semiconductor Technology

Introduction

Jürgen Högerl is a notable inventor based in Wuppertal, Germany. He has made significant contributions to the field of semiconductor technology, holding a total of 6 patents. His work focuses on improving the efficiency and reliability of semiconductor assemblies and circuit configurations.

Latest Patents

Högerl's latest patents include a semiconductor assembly with a semiconductor module. This innovative assembly features a module holder and a semiconductor module that consists of a board substrate with conductor tracks. The module includes one or more unpackaged semiconductor chips that are mounted on the substrate and connected to the conductor tracks via electrical contacts. The design incorporates a contact strip with connection contact areas, facilitating economical connections to external components.

Another significant patent involves the configuration of a plurality of circuit modules. This circuit configuration allows for reliable and straightforward interconnections between circuit modules. It includes a connection carrier and circuit modules arranged in a stacked formation. Each module is equipped with a connecting device for external electrical bonding, enhancing the overall functionality and efficiency of the circuit design.

Career Highlights

Högerl is currently employed at Infineon Technologies AG, a leading company in semiconductor solutions. His work at Infineon has allowed him to push the boundaries of semiconductor technology, contributing to advancements that benefit various industries.

Collaborations

Throughout his career, Jürgen Högerl has collaborated with esteemed colleagues such as Stefan Paulus and Erich Syri. These partnerships have fostered innovation and have been instrumental in the development of his patented technologies.

Conclusion

Jürgen Högerl's contributions to semiconductor technology exemplify his commitment to innovation and excellence. His patents reflect a deep understanding of the complexities involved in semiconductor assemblies and circuit configurations. His work continues to influence the industry and pave the way for future advancements.